• Pitch 0.8 mm • SMT process compatible • Hermaphroditic contact design, two contact points • One part number for interconnection saving admin and logistic costs • Integrated pick and place pad and very low weight for high speed assembly • Positioning pegs • Secure standing while solder process, large solder pads • Black insulation body and silver terminals for optical vision system (contrast measuring methode) • Polarization and pre-alignment while mating • Mated stacking height: 5 mm (wipe length: 1.5 mm)

Verfügbarkeit: lieferbar versandfertig innerhalb 24h